I have several doubts about circuit model.
1): the txt file exported from Mode solution(FDE) has “loss” item (1.png). while the “Mode Waveguide” element also has loss and excess loss items (2.png) , where the “loss” item refers to propagation loss and “excess loss” refers to the loss caused by fabrication (for example, roughness of the sidewall).
The exported txt file contain loss, does it means the exported ldf file also contain loss item？ If so, what is the relationship between the “loss” in ldf file and “loss” in “Mode Waveguide” element ?
Which kind of loss does the loss measured by experiment belong to?
2）: when a mode profile of a bend waveguide (R=10um,angle=90) is imported to Interconnect, its length is a fixed value, which is equal to pi100.5, right?
3): For mmi, is it posible to build compact model by a way of combining the simulation result (S matrix )of Mode or FDTD and performance (insertion loss and power imbalance) by experimenat measure?